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july 2007 rev 2 1/11 11 table 1. device summary order codes marking package packaging BULD741T4 buld741 dpak tape & reel buld741-1 buld741 ipak tube buld741 high voltage fast-switching npn power transistor features high voltage capability low spread of dynamic parameters minimum lot-to-lot spread for reliable operation very high switching speed description the device is manufactured using high voltage multi-epitaxial planar technology for high switching speeds and high voltage capability. thanks to an increased intermediate layer, it has an intrinsic ruggedness which enables the transistor to withstand an high collector current level during breakdown condition, without using the transil protection usually necessary in typical converters for lamp ballast. applications electronic ballast for fluorescent lighting switch mode power supplies. figure 1. internal schematic diagram dpak 1 3 3 2 1 ipak to-252 to-251 www.st.com
electrical ratings buld741 2/11 1 electrical ratings table 3. thermal data table 2. absolute maximum rating symbol parameter value unit v ces collector-emitter voltage (v be = 0) 1050 v v ceo collector-emitter voltage (i b = 0) 400 v v ebo emitter-base voltage (i c = 0, i b = 2a, t p < 10ms) v (br)ebo v i c collector current 2.5 a i cm collector peak current (t p < 5ms) 5 a i b base current 1.5 a i bm base peak current (t p < 5ms) 3 a p tot total dissipation at t c = 25c 30 w t stg storage temperature -65 to 150 c t j max. operating junction temperature 150 c symbol parameter value unit r thj-case thermal resistance junction-case __ max 4.16 c/w
buld741 electrical characteristics 3/11 2 electrical characteristics (t case = 25c unless otherwise specified) note (1) pulsed duration = 300 s, duty cycle 1.5% table 4. electrical characteristics symbol parameter test conditions min. typ. max. unit i ces collector cut-off current (v be =0v) v ce =1050v 0.2 10 a i ceo collector cut-off current (i b =0) v ce =400v 10 250 a v (br)ebo emitter-base breakdown voltage (i c = 0) i e =1ma 15 19 24 v v ceo(sus) (1) collector-emitter sustaining voltage (i b = 0) i c =10ma 400 450 v v ce(sat) (1) collector-emitter saturation voltage i c =0.7a i b =0.14a i c =2a i b =0.6a 0.15 0.5 0.5 1.5 v v v be(sat) (1) base-emitter saturation voltage i c =2a i b =0.6a 1.1 1.5 v h fe dc current gain i c =0.1a v ce =5v i c =0.45a v ce =3v 48 25 70 35 100 50 t s t f resistive load storage time fall time v cc =125v i c =1a i b1 = -i b2 =0.2a t p = 300 s v be(off) =-5v 2.5 350 3.5 500 s ns e ar repetitive avalanche energy l =2mh c =1.8nf v be(off) =-5v 5mj
electrical characteristics buld741 4/11 2.1 electrical characteristics (curves) figure 2. safe operating area figure 3. derating curve figure 4. output characteristics figure 5. reverse biased safe operating area figure 6. dc current gain figure 7. dc current gain
buld741 electrical characteristics 5/11 figure 8. base-emitter saturation voltage figure 9. collector-emitter saturation voltage figure 10. resistive load switching on times figure 11. resistive load switching on times figure 12. resistive load switching off times figure 13. resistive load switching off times
electrical characteristics buld741 6/11 2.2 test circuits figure 14. resistive load switching test circuit figure 15. energy rating test circuit 1) fast electronic switch 2) non-inductive resistor
buld741 package mechanical data 7/11 3 package mechanical data in order to meet environmental requirements, st offers these devices in ecopack? packages. these packages have a lead-free second level interconnect. the category of second level interconnect is marked on the package and on the inner box label, in compliance with jedec standard jesd97. the maximum ratings related to soldering conditions are also marked on the inner box label. ecopack is an st trademark. ecopack specifications are available at: www.st.com
package mechanical data buld741 8/11 dim. mm inch min. typ. max. min. typ. max. a 2.20 2.40 0.087 0.094 a1 0.90 1.10 0.035 0.043 a2 0.03 0.23 0.001 0.009 b 0.64 0.90 0.025 0.035 b2 5.20 5.40 0.204 0.213 c 0.45 0.60 0.018 0.024 c2 0.48 0.60 0.019 0.024 d 6.00 6.20 0.236 0.244 e 6.40 6.60 0.252 0.260 g 4.40 4.60 0.173 0.181 h 9.35 10.10 0.368 0.398 l2 0.8 0.031 l4 0.60 1.00 0.024 0.039 v2 0 o 8 o 0 o 0 o p032p_b to-252 (dpak) mechanical data
buld741 package mechanical data 9/11 dim. mm inch min. typ. max. min. typ. max. a 2.20 2.40 0.087 0.094 a1 0.90 1.10 0.035 0.043 a3 0.70 1.30 0.028 0.051 b 0.64 0.90 0.025 0.035 b2 5.20 5.40 0.204 0.213 b3 0.85 0.033 b5 0.30 0.012 b6 0.95 0.037 c 0.45 0.60 0.018 0.024 c2 0.48 0.60 0.019 0.024 d 6.00 6.20 0.237 0.244 e 6.40 6.60 0.252 0.260 g 4.40 4.60 0.173 0.181 h 15.90 16.30 0.626 0.642 l 9.00 9.40 0.354 0.370 l1 0.80 1.20 0.031 0.047 l2 0.80 1.00 0.031 0.039 v1 10 o 10 o p032n_e to-251 (ipak) mechanical data
revision history buld741 10/11 4 revision history table 5. revision history date revision changes 20-dec-2006 1 initial release. 09-jul-2007 2 updated package names in page 1, added figure 4, updated figure 12 and 13.
buld741 11/11 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at an y time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a particular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorize representative of st, st products are not recommended, authorized or warranted for use in military, air craft, space, life saving, or life sustaining applications, nor in products or systems, where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as ?automotive grade? may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, an y liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2007 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com

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